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Chemically Resistant adhesives

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Rogers Corporation RT/duroid® 6202 High Frequency Laminate
Categories: Polymer

Material Notes: Features:
  • Low loss for excellent high frequency performance
  • Tight dielectric constant and thickness control
  • Excellent electrical and mechanical properties
  • Extremely low thermal coefficient of dielectric constant
  • In-plane expansion coefficient matched to copper
  • Very low etch shrinkage
  • Cladding - EDC
  • Lead-free process compatible

Typical Applications:

  • Phase Array Antennas
  • Ground Based and Airborne Radar Systems
  • Global Positioning System Antennas
  • Power Backplanes
  • High Reliability Complex Multilayer Circuits
  • Commercial Airline Collision Avoidance Systems
  • Beam Forming Networks

Information provided by Rogers Corporation.

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Physical PropertiesOriginal ValueComments
Density 2.10 g/ccASTM D792
Moisture Absorption at Equilibrium 0.10 %D23/24; D48/50; IPC-TM-650 2.6.2.1; ASTM D570
Thickness 5.00 - 60.0 milRange of Standard Thicknesses
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Ultimate 30.0 MPaX, Y direction; ASTM D638
Elongation at Break 4.9 %X, Y direction; ASTM D638
Tensile Modulus 146 ksiX, Y direction; ASTM D638
Compressive Modulus 1035 MPaZ direction; ASTM D638
Peel Strength 9.10 pliCopper; IPC-TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+12 ohm-cmCondition A; Z direction; ASTM D257
Surface Resistance 1.00e+15 ohmCondition A; Z direction; ASTM D257
Dielectric Constant 2.9 - 2.98
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
Dissipation Factor 0.0015
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesOriginal ValueComments
CTE, linear 15.0 µm/m-°CX-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41
 15.0 µm/m-°CY-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41
 30.0 µm/m-°CZ-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41
Specific Heat Capacity 0.930 J/g-°Ccalculated
Thermal Conductivity 0.680 W/m-K
@Temperature 80.0 °C
ASTM C518
Decomposition Temperature 500 °CTGA; ASTM D3850
Flammability, UL94 V-0
 
Descriptive Properties
Thermal Coefficient of Dielectric Constant13 ppm/°CPreliminary; IPC-TM-650 2.5.5.5; 10 GHz; 0°C to 100°C; Z-Direction

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PROGA976 / 138416

Chemically Resistant adhesives

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