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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® H70E-2LC Thermally Conductive, Electrically Insulating Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Material Description: A two component, thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.63 g/ccPart A
 2.31 g/ccPart B
Particle Size <= 50 µm
Viscosity 6500 - 9500 cP
@Temperature 23.0 °C
20 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Cl (Chloride) 194 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 72
Tensile Modulus 925000 psiStorage
Shear Strength 1968 psiLap
 >= 3400 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.50e+13 ohm-cm
Dielectric Constant 5.05
@Frequency 1000 Hz
Dissipation Factor 0.0066
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 18.0 µm/m-°CBelow Tg
 75.0 µm/m-°CAbove Tg
Thermal Conductivity 0.790 W/m-K
Maximum Service Temperature, Air 175 °CContinuous
 350 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 60.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 400 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 min
@Temperature 175 °C
Minimum Bond Line
 5.00 min
@Temperature 150 °C
Minimum Bond Line
 15.0 min
@Temperature 120 °C
Minimum Bond Line
 90.0 min
@Temperature 80.0 °C
Minimum Bond Line
Pot Life 3600 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorBlackPart A
 CreamPart B
ConsistencySmooth thixotropic paste
Mix Ratio by Weight1:1
Number of ComponentsTwo
Thixotropic Index3.26
Weight Loss0.67%250°C

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PPOXYT075 / 141114

Chemically Resistant adhesives

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