Epoxy Technology EPO-TEK® H70E-2LC Thermally Conductive, Electrically Insulating Epoxy

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Epoxy Technology EPO-TEK® H70E-2LC Thermally Conductive, Electrically Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Material Description: A two component, thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	1.63 g/cc	1.63 g/cc	Part A
	2.31 g/cc	2.31 g/cc	Part B
Particle Size	<= 50 µm	<= 50 µm
Viscosity	6500 - 9500 cP @Temperature 23.0 °C	6500 - 9500 cP @Temperature 73.4 °F	20 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Cl (Chloride)	194 ppm	194 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	72	72
Tensile Modulus	6.37 GPa	925 ksi	Storage
Shear Strength	13.57 MPa	1968 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.50e+13 ohm-cm	>= 1.50e+13 ohm-cm
Dielectric Constant	5.05 @Frequency 1000 Hz	5.05 @Frequency 1000 Hz
Dissipation Factor	0.0066 @Frequency 1000 Hz	0.0066 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	18.0 µm/m-°C	10.0 µin/in-°F	Below Tg
	75.0 µm/m-°C	41.7 µin/in-°F	Above Tg
Thermal Conductivity	0.790 W/m-K	5.48 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	175 °C	347 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 60.0 °C	>= 140 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	400 °C	752 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	1.00 min @Temperature 175 °C	0.0167 hour @Temperature 347 °F	Minimum Bond Line
	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F	Minimum Bond Line
	90.0 min @Temperature 80.0 °C	1.50 hour @Temperature 176 °F	Minimum Bond Line
Pot Life	3600 min	3600 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties
Color	Black		Part A
	Cream		Part B
Consistency	Smooth thixotropic paste
Mix Ratio by Weight	1:1
Number of Components	Two
Thixotropic Index	3.26
Weight Loss	0.67%		250°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT075 / 141114

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