This material is a fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. It was developed with fine filler particles especially for use with automated or conventional molding equipment and offers a balance of end use properties. Features - Excellent moldability
- Superior cosmetics
- Improved markability
- Fast cycle times
Information provided by Cookson Electronics |