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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® E3037 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.

Information Provided by Epoxy Technology

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 3.07 g/cc
Particle Size <= 20 µm
Viscosity 22000 - 26000 cP
@Temperature 23.0 °C
10 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 22 ppm
Ionic Impurities - K (Potassium) 3.0 ppm
Ionic Impurities - Cl (Chloride) 187 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80
Tensile Modulus 727680 psiStorage
Shear Strength 1880 psiLap
 >= 3400 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.00050 ohm-cm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 52.0 µm/m-°CBelow Tg
 148 µm/m-°CAbove Tg
Thermal Conductivity 1.59 W/m-K
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 90.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 358 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 hour
@Temperature 150 °C
minimum
Pot Life 40320 min
Shelf Life 12.0 Month
@Temperature -40.0 °C
 
Descriptive Properties
ColorSilver
ConsistencySmooth flowing paste
Ionic Impurities NH465 ppm
Number of ComponentsSingle
Thixotropic Index3.62
Weight Loss0.13%200°C
 0.41%250°C
 0.8%300°C

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PPOXYT013 / 141051

Chemically Resistant adhesives

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