Hexcel® HexPly® F593 Epoxy Resin

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Hexcel® HexPly® F593 Epoxy Resin
Categories:	Polymer; Thermoset; Epoxy; Epoxy Cure Resin
Material Notes:	HexPly® F593 is a modified 350°F (177°C) curing epoxy system with very low flow for carbon fabric and tape applications that provides excellent laminate and honeycomb sandwich properties. As a low flow resin, HexPly® F593 lends itself to net resin, zero bleed applications. HexPly® F593's adhesive properties allow for the elimination of adhesive layers in co-curing sandwich structures. HexPly® F593 low flow minimizes sandwich part porosity. Information provided by HexCel
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Physical Properties	Metric	English	Comments

Specific Gravity	1.22 g/cc	1.22 g/cc
Volatiles	3.92 %	3.92 %	After 30 min at 177ºC
Moisture Absorption at Equilibrium	4.2 %	4.2 %

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	60.4 MPa	8760 psi
Elongation at Yield	2.0 %	2.0 %
Tensile Modulus	2.96 GPa	429 ksi
Poissons Ratio	0.35	0.35
Fracture Toughness	1.22 MPa-m½	1.11 ksi-in½
Shear Modulus	1.10 GPa	160 ksi	Calculated

Thermal Properties	Metric	English	Comments
CTE, linear	54.0 µm/m-°C	30.0 µin/in-°F
Glass Transition Temp, Tg	131 °C	268 °F	Wet
	172 °C	342 °F	Dry

Processing Properties	Metric	English	Comments
Gel Time	9.00 - 17.0 min @Temperature 177 °C	9.00 - 17.0 min @Temperature 351 °F

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PHEXC146 / 98616

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