Henkel Loctite® ABLESTIK ABP 8420 Epoxy

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Henkel Loctite® ABLESTIK ABP 8420 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black paste Cure: Heat cure Product Benefits: Non-conductive Excellent resin bleed out (RBO) Performance Fast cure Black pigmentation for blocking stray light Good adhesion to PA substrates Good reliability performance Application: Die attach Key Substrates: Most plastics and Glass Typical Applications: Cap, diffuser attach in wirebond packages LOCTITE ABLESTIK ABP 8420 non-conductive adhesive is designed for cap and lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring. Information provided by Loctite®
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Brookfield Viscosity	13500 cP	13500 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Metric	English	Comments
Tensile Modulus	0.0840 GPa @Temperature 250 °C	12.2 ksi @Temperature 482 °F	Cured, DMA
	0.0900 GPa @Temperature 150 °C	13.1 ksi @Temperature 302 °F	Cured, DMA
	1.919 GPa @Temperature 100 °C	278.3 ksi @Temperature 212 °F	Cured, DMA
	2.85 GPa @Temperature 25.0 °C	413 ksi @Temperature 77.0 °F	Cured, DMA

Thermal Properties	Metric	English	Comments
CTE, linear	54.0 µm/m-°C	30.0 µin/in-°F	Cured, Below Tg
	154 µm/m-°C	85.6 µin/in-°F	Cured, Above Tg
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	Cured
Glass Transition Temp, Tg	75.0 °C	167 °F	Cured

Processing Properties	Metric	English	Comments
Cure Time	30.0 min	0.500 hour	ramp to 150ºC, hold 15 minutes @ 150 °C
	30.0 min @Temperature 100 °C	0.500 hour @Temperature 212 °F	Alternate Cure Schedule
	120 min @Temperature 80.0 °C	2.00 hour @Temperature 176 °F	Alternate Cure Schedule
Working Life	1440 min	1440 min
Shelf Life	3.00 Month @Temperature -20.0 °C	3.00 Month @Temperature -4.00 °F	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<120		Cured, Chloride (Cl-)
	<5		Cured, Sodium (Na+)
	<5		Cured, Potassium (K+)
Shear Strength	12 kg-f		Die, 2 x 2 mm Si die on PA
	12 kg-f		Die, 3 x 3 mm Glass die on PC
	13 kg-f		Die, 2 x 2 mm Si die on Cu LF
	15.5 kg-f		Die, 2 x 2 mm Si die on GBA
	6 kg-f		Die, 1 x 1 mm Si die on glass
Thixotropic Index	5.8		Uncured, 0.5/5 rpm
Water Extract Conductivity	147 µmhos/cm		Cured
Weight Loss (%)	0.5		on Cure

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

PLOCT5044 / 255255

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message