Henkel Loctite® ABLESTIK ABP 8420 Epoxy

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Henkel Loctite® ABLESTIK ABP 8420 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black paste Cure: Heat cure Product Benefits: Non-conductive Excellent resin bleed out (RBO) Performance Fast cure Black pigmentation for blocking stray light Good adhesion to PA substrates Good reliability performance Application: Die attach Key Substrates: Most plastics and Glass Typical Applications: Cap, diffuser attach in wirebond packages LOCTITE ABLESTIK ABP 8420 non-conductive adhesive is designed for cap and lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	13500 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	84.0 MPa @Temperature 250 °C	Cured, DMA
	90.0 MPa @Temperature 150 °C	Cured, DMA
	1919 MPa @Temperature 100 °C	Cured, DMA
	2850 MPa @Temperature 25.0 °C	Cured, DMA

Thermal Properties	Original Value	Comments
CTE, linear	54.0 µm/m-°C	Cured, Below Tg
	154 µm/m-°C	Cured, Above Tg
Thermal Conductivity	0.300 W/m-K	Cured
Glass Transition Temp, Tg	75.0 °C	Cured

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 150ºC, hold 15 minutes @ 150 °C
	30.0 min @Temperature 100 °C	Alternate Cure Schedule
	120 min @Temperature 80.0 °C	Alternate Cure Schedule
Working Life	24.0 hour
Shelf Life	3.00 Month @Temperature -20.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<120	Cured, Chloride (Cl-)
	<5	Cured, Sodium (Na+)
	<5	Cured, Potassium (K+)
Shear Strength	12 kg-f	Die, 2 x 2 mm Si die on PA
	12 kg-f	Die, 3 x 3 mm Glass die on PC
	13 kg-f	Die, 2 x 2 mm Si die on Cu LF
	15.5 kg-f	Die, 2 x 2 mm Si die on GBA
	6 kg-f	Die, 1 x 1 mm Si die on glass
Thixotropic Index	5.8	Uncured, 0.5/5 rpm
Water Extract Conductivity	147 µmhos/cm	Cured
Weight Loss (%)	0.5	on Cure

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PLOCT5044 / 255255

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