| COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate. Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.
Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg Underfill
A high performance underfill for flip chip devices. Specifically formatted for high reliability, hybrid and MCM applications. Designed for gaps down to 1 mil. |
