Advantages & Application Notes:

• Heat-sinking adhesive. It is particularly recommended for thermal management applications where good heat dissipation is necessary.
• The excellent handling characteristics and the long pot life at room temperature for this unique, two component system is obtained without the use of solvents.
• Easy to use. It can be screen printed, machine dispensed, stamped, or hand applied.
• Die-attach adhesive designed to be used in the 300°C range to resist TC wire bonding operations. Meets JEDEC Level III and II packaging criteria.
• Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB.
• Can be cured very rapidly; excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
• Passes NASA low outgassing standard ASTM E595 with proper cure

Information Provided by Epoxy Technology