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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy
Categories: Polymer; Thermoset; Epoxy
Material Notes: Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries.

Advantages & Application Notes:

  • Viscosity/rheology adapted to high volume syringe needle dispensing with no tailing.
  • Complies with USP Class VI biocompatibility standards.
  • Versatility in cure. Product responds to a broad range of UV light, and secondary thermal post-curing.
  • Suggested applications:
    • Semiconductor: COB glob top covering IC’s and wire bonds; glob top dam; encapsulating and sealing; adhesion to FR4, Kapton, silicon.
    • Fiber Optic: making fiber optic pigtails; active alignment of optics; adhesion to many types of glass, metals, ceramics and plastics.
    • Opto-electronic:
      • Perimeter/main seal for LCD’s, compatible with VAN liquid crystal for LCoS devices.
  • High Tg and low outgassing are indicative of its high temperature performance.

Information Provided by Epoxy Technology
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.20 g/cc1.20 g/cc
Particle Size <= 20 µm<= 20 µm
Viscosity 20000 - 30000 cP
@Temperature 23.0 °C		20000 - 30000 cP
@Temperature 73.4 °F		10 rpm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8383
Tensile Modulus 1.82 GPa264 ksiStorage
Shear Strength 23.4 MPa3400 psiDie
 
Thermal PropertiesMetricEnglishComments
CTE, linear 41.0 µm/m-°C22.8 µin/in-°FBelow Tg
 170 µm/m-°C94.4 µin/in-°FAbove Tg
Maximum Service Temperature, Air 200 °C392 °FContinuous
 300 °C572 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 115 °C>= 239 °FDynamic Post- Cure Scan 20—200°C; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 409 °C768 °FDegradation Temperature
 
Optical PropertiesMetricEnglishComments
Refractive Index 1.5662
@Wavelength 589 nm		1.5662
@Wavelength 589 nm
Transmission, Visible  >= 92 %
@Wavelength 500 nm		>= 92 %
@Wavelength 500 nm		Spectral
 >= 96 %
@Wavelength 660 - 1640 nm		>= 96 %
@Wavelength 660 - 1640 nm		Spectral
 
Processing PropertiesMetricEnglishComments
Shelf Life 12.0 Month
@Temperature 25.0 °C		12.0 Month
@Temperature 77.0 °F
 
Compliance PropertiesMetricEnglishComments
USP Class VI YesYes
 
Descriptive Properties
ColorCloudy Whitebefore cure
ConsistencyViscous liquid
Number of ComponentsSingle
Thixotropic Index1.3
Weight Loss0.31%200°C
 0.68%250°C
 1.18%300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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Overview of materials for Epoxy/Carbon Fiber Composite

PPOXYT164 / 141203

USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.




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