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Elmet Technologies

Parker Chomerics Tecknit® 0192/0193 Conductive Silicone Sealant/Adhesive
Categories: Polymer; Adhesive; Thermoset; Silicone

Material Notes: Comments: Rec. bond line thickness: < 0.4 mm; flexible past.

Typical Applications: Bonding Ag/Cu elastomer gaskets; thin bond gap.

Information provided by Chomerics

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Physical PropertiesMetricEnglishComments
Specific Gravity 3.80 g/cc3.80 g/cc
Volatile Organic Compounds (VOC) Content 0.00 g/l0.00 g/l
Thickness 254 microns10.0 mil
 
Mechanical PropertiesMetricEnglishComments
Shear Strength >= 1.38 MPa>= 200 psi
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.040 ohm-cm<= 0.040 ohm-cm
 
Processing PropertiesMetricEnglishComments
Cure Time 10100 min
@Temperature 24.0 °C
168 hour
@Temperature 75.2 °F
Shelf Life 9.00 Month9.00 Month
 
Descriptive Properties
FillerAg/Cu
Resin SystemSilicone

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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