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Ensinger PEI

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Parker Chomerics Tecknit® 0192/0193 Conductive Silicone Sealant/Adhesive
Categories: Polymer; Adhesive; Thermoset; Silicone

Material Notes: Comments: Rec. bond line thickness: < 0.4 mm; flexible past.

Typical Applications: Bonding Ag/Cu elastomer gaskets; thin bond gap.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 3.80 g/cc
Volatile Organic Compounds (VOC) Content 0.00 g/l
Thickness 254 microns
 
Mechanical PropertiesOriginal ValueComments
Shear Strength >= 1.38 MPa
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.040 ohm-cm
 
Processing PropertiesOriginal ValueComments
Cure Time 168 hour
@Temperature 24.0 °C
Shelf Life 9.00 Month
 
Descriptive Properties
FillerAg/Cu
Resin SystemSilicone

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