UBE UPISEL-N BE1210 Copper Clad Laminate

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UBE UPISEL-N BE1210 Copper Clad Laminate
Categories:	Metal; Polymer
Material Notes:	Description: UPISEL-N BE1210 is non-adhesive type flexible Copper Clad Laminate (Polyimide = 25µm, Cu = 18µm) based on "UPILEX-VT." UPISEL-N has excellent dimensional stability and heat resistance. "UPILEX-VT" performs high bonding ability without any use of adhesives by simple heat lamination. "UPILEX-VT" is an aromatic polyimide same as "UPILEX-S" which has high market share as the base film for TAB (Tape Automated Bonding). Applications: FPC TCP MCM-L COF Rigid flex Multi-layer boards Metal based boards High frequency boards Heat-resistant boards IC cards Boards for automobile Electromagnetic wave shield material HDD suspension Characteristics: Without the use of adhesives, UPISEL-N maintains high physical properties and high reliability at high temperatures It performs excellent peeling strength, heat soldering resistance, chemical resistance and dimensional stability The film layer of the UPISEL-N can be heat bonded with ceramics, metals and silicon chip Without the use of adhesives, UPISEL-N is tender for the environment Information provided by UBE.
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Physical Properties	Metric	English	Comments

Water Absorption	1.0 %	1.0 %	IPCTM 650

Mechanical Properties	Metric	English	Comments
Elongation at Break	54 %	54 %	ASTM D882
Tensile Modulus	6.67 GPa	967 ksi	ASTM D882
Peel Strength	0.686 kN/m	3.91 pli	T Peel (Width=10), 300°C; IPC-FC-241B
	1.08 kN/m	6.16 pli	90° Peel (Width=10) after 200°C for 7 days; IPC-FC-241B
	1.08 kN/m	6.16 pli	90° Peel (Width=3.2), 100% Retained with 2N-HCl or 2N-NaOH; IPC-FC-241B
	1.275 kN/m	7.275 pli	T Peel (Width=10), 250°C; IPC-FC-241B
	1.37 kN/m	7.82 pli	T Peel (Width=10), 25°C; IPC-FC-241B

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 5.00e+16 ohm-cm	>= 5.00e+16 ohm-cm	ASTM D257
Surface Resistance	>= 1.00e+14 ohm	>= 1.00e+14 ohm	ASTM D257
Dielectric Constant	3.2 @Frequency 1000 Hz	3.2 @Frequency 1000 Hz	ASTM D150
Dissipation Factor	0.0023 @Frequency 1000 Hz	0.0023 @Frequency 1000 Hz	ASTM D150

Thermal Properties	Metric	English	Comments
Flammability, UL94	V-0	V-0	VTM-0
Shrinkage	0.025 %	0.025 %	After Cu Etching; IPC-FC-241B
	0.060 %	0.060 %	After Cu Etching; IPC-FC-241B
	0.035 % @Temperature 150 °C, Time 1800 sec	0.035 % @Temperature 302 °F, Time 0.500 hour	IPC-FC-241B
	0.080 % @Temperature 150 °C, Time 1800 sec	0.080 % @Temperature 302 °F, Time 0.500 hour	IPC-FC-241B

Descriptive Properties
Flexural Endurance (MD)	110,000 cycles		IPC-FC-241B
Flexural Endurance (TD)	150,000 cycles		IPC-FC-241B
Folding Endurance RO.4 (MD)	48 cycles		JPCA FC01
Folding Endurance RO.4 (TD)	48 cycles		JPCA FC01
Hot Solder Resistance: 300°C 1 min.	No Change		IPC-FC-241B

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PUBE241 / 71799

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