CoorsTek Hot Pressed Aluminum Nitride

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CoorsTek Hot Pressed Aluminum Nitride
Categories:	Ceramic; Nitride
Material Notes:	Aluminum Nitride Advantages: High heat dissipation with thermal conductivity of 170 W/m K Non-toxic alternative to BeO Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors High dielectric strength Information provided by CoorsTek, Inc.
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Physical Properties	Metric	English	Comments

Density	3.26 g/cc	0.118 lb/in³	ASTM C20
Water Absorption	0.00 %	0.00 %	ASTM 373
Permeability	0.00	0.00	Gas

Mechanical Properties	Metric	English	Comments
Hardness, Knoop	11	11	1000gm
Modulus of Elasticity	330 GPa	47900 ksi	ASTM C848
Flexural Strength	340 MPa	49300 psi	MOR, Four point bend modulus of rupture; ASTM F417
Poissons Ratio	0.25	0.25	ASTM C848
Fracture Toughness	3.00 MPa-m½	2.73 ksi-in½	K_Ic; Notched Beam
Shear Modulus	132 GPa	19100 ksi	Calculated

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1000 ohm-cm @Temperature 1000 °C	>= 1000 ohm-cm @Temperature 1830 °F	ASTM D1829
	>= 1e+05 @Temperature 500 °C	>= 1e+05 @Temperature 932 °F	ASTM D1829
	>= 1.00e+13 ohm-cm @Temperature 25.0 °C	>= 1.00e+13 ohm-cm @Temperature 77.0 °F	ASTM D1829
Dielectric Constant	9.0 @Frequency 1e+6 Hz	9.0 @Frequency 1e+6 Hz	ASTM D150
Dielectric Strength	17.0 kV/mm @Thickness 6.35 mm	432 kV/in @Thickness 0.250 in	ASTM D150
Dielectric Loss Index	<= 0.0010 @Frequency 1e+6 Hz	<= 0.0010 @Frequency 1e+6 Hz	ASTM D150

Thermal Properties	Metric	English	Comments
CTE, linear	5.00 µm/m-°C @Temperature 25.0 - 1000 °C	2.78 µin/in-°F @Temperature 77.0 - 1830 °F	ASTM C372
Specific Heat Capacity	0.740 J/g-°C @Temperature 100 °C	0.177 BTU/lb-°F @Temperature 212 °F	ASTM E1269
Thermal Conductivity	80.0 W/m-K	555 BTU-in/hr-ft²-°F	ASTM C408
Maximum Service Temperature, Air	800 °C	1470 °F	No load condition

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CCOOR938 / 140553

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