Tra-Con Tra-Bond 2222 One-Part Surface Mount Epoxy Adhesive

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Tra-Con Tra-Bond 2222 One-Part Surface Mount Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy
Material Notes:	TRA-BOND 2222 is a solvent-free, one-part thixotropic, epoxy adhesive recommended for SMD (Surface Mount Device) bonding and sealing applications where its easy handling, high strength and superior electrical insulation features are required. This smooth paste adhesive can be dispensed pneumatically, or by screen or pin transfer without stringing or tailing, and can position components before cure. TRA-BOND 2222 has a six month shelf life and develops strong, durable, solvent-resistant bonds - after a required high temperature cure cycle - to and between many different materials such as semiconductors, ceramics, glass, metals, and laminates. It is ideal for bonding chip-on-board, active and/or passive chip-type components in the fabrication of printed, integrated and hybrid circuits, and is just right for screen printing and epoxy die mounting applications, or for the assembly and repair of printed circuits, wave guides and electrical modules. Information provided by Tra-Con Inc.
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Physical Properties	Metric	English	Comments

Specific Gravity	1.30 g/cc	1.30 g/cc	Mixed
Solids Content	100 %	100 %	Reactive Solids Content
Volatile Organic Compounds (VOC) Content	2.29 g/l	2.29 g/l
Water Absorption	0.010 %	0.010 %	After 24 hours
Viscosity	286000 cP	286000 cP	Mixed, degassed

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	86	86
Adhesive Bond Strength	5.03 MPa	730 psi	Lap shear, alum to alum, 15 min @ 100°C
	5.07 MPa	735 psi	Lap shear, alum to alum, 15 min @ 120°C
	11.3 MPa	1640 psi	Lap shear, alum to alum, 8 min @ 150°C

Electrical Properties	Metric	English	Comments
Volume Resistivity	5.00e+15 ohm-cm	5.00e+15 ohm-cm
Dielectric Constant	3.5 @Frequency 1000 Hz	3.5 @Frequency 1000 Hz
Dielectric Strength	19.7 kV/mm	500 kV/in
Dissipation Factor	0.010 @Frequency 1000 Hz	0.010 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-50.0 °C	-58.0 °F
Glass Transition Temp, Tg	75.0 °C	167 °F	Ultimate Tg

Processing Properties	Metric	English	Comments
Cure Time	8.00 min @Temperature 150 °C	0.133 hour @Temperature 302 °F
	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F	for higher property development
	>= 15.0 min @Temperature 100 °C	>= 0.250 hour @Temperature 212 °F

Descriptive Properties
Color	Red-Brown
Outgassing, NASA	Passes
Working Life months	3		At 25°C
	6		At 20°C

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PTRAC065 / 70993

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