Dymax 9001v3.0 Low Modulus Clear Microencapsulant

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Dymax 9001v3.0 Low Modulus Clear Microencapsulant
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 9001v3.0 Low Modulus Clear Microencapsulant Lowest stress potting and encapsulation on ceramic, FR-4 or flexible PCBs as well as flip chip, IC cards and other high flow applications Cure Type: UV/Visible Typical Use: High flow for IC cards and flip chip assembly
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Viscosity	400 cP	400 cP

Optical Properties	Metric	English	Comments
Transmission, Visible	90 %	90 %	clear; thickness not quantified

Processing Properties	Metric	English	Comments
Cure Time	0.0333 - 0.167 min	0.000556 - 0.00278 hour	10-20 mil thick layers cured with Dymax 5000-EC at 2 inches. Thicker layers may require more cure time.

Descriptive Properties
Color	Clear

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Epoxy Technology EPO-TEK® 310M-2 Optically Clear, Flexible Epoxy
Sika SikaFlex 219 LM Low Modulus Polyurethane Sealant
Dymax 9001v3.1 Resilient, Low Modulus Clear Microencapsulant
Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy
Elkem (Bluestar Silicones) BLUESIL™ V 1082 HiPro Clear Silicone Rubber

PDYYMAX51 / 35035

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message