Cookson Group Plaskon® SMT-B-2FPI Molding Compound for PBGA and CSP

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Cookson Group Plaskon® SMT-B-2FPI Molding Compound for PBGA and CSP (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound for high temperature, lead-free reflow in fine pitch applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 240°C IR reflow temperatures. Features: Lower moisture pickup Excellent moldability Low wire sweep Fast cure Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.88 g/cc	1.88 g/cc
Moisture Absorption at Equilibrium	0.51 %	0.51 %	at 85°C/85% RH, 168 hours
Viscosity	6500 cP @Temperature 175 °C	6500 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Spiral Flow	140 cm	55.1 in	at 175°C and 1000 psi
Ash	80 %	80 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80	Cull hot
Flexural Strength	98.07 MPa	14220 psi
	19.614 MPa @Temperature 240 °C	2844.7 psi @Temperature 464 °F
Flexural Modulus	13.73 GPa	1991 ksi
	1.471 GPa @Temperature 240 °C	213.4 ksi @Temperature 464 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+12 ohm-cm @Temperature 150 °C	>= 1.00e+12 ohm-cm @Temperature 302 °F
	>= 1.00e+15 ohm-cm @Temperature 22.0 °C	>= 1.00e+15 ohm-cm @Temperature 71.6 °F
Dielectric Constant	4.0 @Frequency 1000 Hz	4.0 @Frequency 1000 Hz
Dielectric Strength	>= 15.7 kV/mm	>= 400 kV/in

Thermal Properties	Metric	English	Comments
CTE, linear	17.0 µm/m-°C @Temperature 20.0 °C	9.44 µin/in-°F @Temperature 68.0 °F	Alpha 1
	55.0 µm/m-°C @Temperature 20.0 °C	30.6 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	210 °C	410 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in

Processing Properties	Metric	English	Comments
Mold Temperature	170 - 185 °C	338 - 365 °F
Back Pressure	5.17 - 8.62 MPa	750 - 1250 psi
Cure Time	1.17 - 2.00 min	0.0194 - 0.0333 hour	In mold
	0.000 - 180 min @Temperature 175 °C	0.000 - 3.00 hour @Temperature 347 °F	Post mold
Gel Time	0.333 min	0.333 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.100 Month	0.100 Month	at 35°C, <40% loss of spiral flow
	0.250 Month	0.250 Month	at 22°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PPLASK015 / 56305

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