Cookson Group Plaskon® PPF-165 Conventional Epoxy Molding Compound

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Cookson Group Plaskon® PPF-165 Conventional Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is a conventional epoxy molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. It increases semiconductor manufacturing productivity and reduces production costs. Features: Low temperature molding Limited post mold cure Fast cure Low viscosity Outstanding reliability Excellent shelf life Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.80 g/cc	1.80 g/cc
Viscosity	1100 cP @Temperature 175 °C	1100 cP @Temperature 347 °F	Automatic orifice Viscosity
Linear Mold Shrinkage	0.0030 cm/cm	0.0030 in/in
Spiral Flow	72.0 cm	28.3 in	at 175°C and 1000 psi
Ash	72 %	72 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	70	70	Cull hot, 90 sec @ 165°C
Flexural Strength	124.2 MPa	18010 psi
Flexural Modulus	15.17 GPa	2200 ksi

Electrical Properties	Metric	English	Comments
Volume Resistivity	5.00e+15 ohm-cm	5.00e+15 ohm-cm
Dielectric Constant	3.5 @Frequency 1000 Hz	3.5 @Frequency 1000 Hz
Dielectric Strength	>= 15.7 kV/mm	>= 400 kV/in
Dissipation Factor	0.0030 @Frequency 1000 Hz	0.0030 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec	110V AC

Thermal Properties	Metric	English	Comments
CTE, linear	21.0 µm/m-°C @Temperature 20.0 °C	11.7 µin/in-°F @Temperature 68.0 °F	Alpha 1, after 30 sec cure at 175°C
	21.0 µm/m-°C @Temperature 20.0 °C	11.7 µin/in-°F @Temperature 68.0 °F	Alpha 1, after 15 minutes post cure at 175°C
	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F	Alpha 2, after 15 minutes post cure at 175°C
	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F	Alpha 2, after 30 sec cure at 175°C
Glass Transition Temp, Tg	130 °C	266 °F
	157 °C	315 °F	After 15 minutes post cure at 175°C
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in
Oxygen Index	30 %	30 %

Processing Properties	Metric	English	Comments
Mold Temperature	165 - 175 °C	329 - 347 °F
Back Pressure	3.45 - 6.89 MPa	500 - 1000 psi
Cure Time	0.500 - 1.00 min @Temperature 175 °C	0.00833 - 0.0167 hour @Temperature 347 °F
	0.000 - 15.0 min @Temperature 175 °C	0.000 - 0.250 hour @Temperature 347 °F	Post mold
Gel Time	0.200 min	0.200 min	Ram follower, at 175°C
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Cl	<1 ppm
Preheat Temperature	85-95°C

**
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PPLASK029 / 56319

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