Cookson Group Plaskon® S-7 Low Stress Epoxy Encapsulant

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Cookson Group Plaskon® S-7 Low Stress Epoxy Encapsulant (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is a state-of-the-art, low stress epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It offers end users superior value-in-use due to a balanced mix of properties. Features: Consistent moldability Outstanding cosmetics and markability Excellent low stress properties Superior reliability Information provided by Cookson Electronics
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Specific Gravity	1.82 g/cc	1.82 g/cc
Viscosity	1700 cP @Diameter 0.500 mm, Temperature 175 °C	1700 cP @Diameter 0.0197 in, Temperature 347 °F	Automatic orifice, at 1000 psi, 1 mm die
Linear Mold Shrinkage	0.0037 cm/cm	0.0037 in/in
Spiral Flow	85.0 - 115 cm	33.5 - 45.3 in	at 177°C and 1000 psi
Ash	73.4 %	73.4 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75	Cull hot, 90 sec @ 175°C
Tensile Strength at Break	62.08 MPa	9004 psi
Flexural Strength	103.0 MPa	14930 psi
Flexural Modulus	12.41 GPa	1799 ksi

Electrical Properties	Metric	English	Comments
Volume Resistivity	5.00e+15 ohm-cm	5.00e+15 ohm-cm
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	15.7 kV/mm	400 kV/in
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec	110V AC

Thermal Properties	Metric	English	Comments
CTE, linear	17.0 µm/m-°C @Temperature 20.0 °C	9.44 µin/in-°F @Temperature 68.0 °F	Alpha 1
	45.0 µm/m-°C @Temperature 20.0 °C	25.0 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.670 W/m-K	4.65 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	150 °C	302 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in
Oxygen Index	32 %	32 %

Processing Properties	Metric	English	Comments
Mold Temperature	170 - 185 °C	338 - 365 °F
Back Pressure	6.21 - 8.27 MPa	900 - 1200 psi
Cure Time	1.00 - 2.00 min @Temperature 177 °C	0.0167 - 0.0333 hour @Temperature 351 °F
	240 - 720 min @Temperature 175 °C	4.00 - 12.0 hour @Temperature 347 °F	Post mold
Gel Time	0.217 - 0.350 min	0.217 - 0.350 min	Ram follower, at 177°C
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Cl	<1 ppm
Preheat Temperature	85-95°C

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Overview of materials for Epoxy Molding Compound
Cookson Group Plaskon® CMU-870-2C Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® CMU-870-2B Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® CMU-870-2A Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound

PPLASK021 / 56311

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message