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Flame Retardant adhesives

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Cookson Group Plaskon® S-7 Low Stress Epoxy Encapsulant  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes: This material is a state-of-the-art, low stress epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It offers end users superior value-in-use due to a balanced mix of properties.

Features:

  • Consistent moldability
  • Outstanding cosmetics and markability
  • Excellent low stress properties
  • Superior reliability

Information provided by Cookson Electronics
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.82 g/cc
Viscosity 1700 cP
@Diameter 0.500 mm,
Temperature 175 °C		Automatic orifice, at 1000 psi, 1 mm die
Linear Mold Shrinkage 0.0037 cm/cm
Spiral Flow 85.0 - 115 cmat 177°C and 1000 psi
Ash 73.4 %
Storage Temperature <= 5.00 °CRecommended
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 75Cull hot, 90 sec @ 175°C
Tensile Strength at Break 62.08 MPa
Flexural Strength 14930 psi
Flexural Modulus 1.799e+6 psi
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 5.00e+15 ohm-cm
Dielectric Constant 3.8
@Frequency 1000 Hz
Dielectric Strength 400 V/mil
Dissipation Factor 0.0020
@Frequency 1000 Hz
Arc Resistance 180 sec110V AC
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.0 µm/m-°C
@Temperature 20.0 °C		Alpha 1
 45.0 µm/m-°C
@Temperature 20.0 °C		Alpha 2
Thermal Conductivity 0.670 W/m-K
Glass Transition Temp, Tg 150 °C
Flammability, UL94 V-0
@Thickness 3.17 mm
Oxygen Index 32 %
 
Processing PropertiesOriginal ValueComments
Mold Temperature 170 - 185 °C
Back Pressure 900 - 1200 psi
Cure Time 4.00 - 12.0 hour
@Temperature 175 °C		Post mold
 60.0 - 120 sec
@Temperature 177 °C
Gel Time 0.217 - 0.350 minRam follower, at 177°C
Shelf Life 0.0670 Monthat 35°C, <40% loss of spiral flow
 0.167 Monthat 21°C, <40% loss of spiral flow
 24.0 Monthat 5°C, <40% loss of spiral flow
 
Descriptive Properties
Hydrolyzable Cl<1 ppm
Preheat Temperature85-95°C

**
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PPLASK021 / 56311

Flame Retardant adhesives




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