Cookson Group Plaskon® LS-16 Low Stress Epoxy Molding Compound

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Cookson Group Plaskon® LS-16 Low Stress Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is a low stress molding compound specifically formulated for use with automated molding equipment to increase semiconductor manufacturing productivity and reduce production costs. This compound is recommended for molding of stress sensitive DIPs, SOICs, PLCCs and small QFPs. Features: Consistent, expedient moldability Broad range of molding temperatures Fast cycle times Low viscosity Minimal post mold cure Low stress Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.83 g/cc	1.83 g/cc
Viscosity	1800 cP @Temperature 165 °C	1800 cP @Temperature 329 °F	Automatic orifice
Spiral Flow	51.0 cm	20.1 in	at 165°C and 1000 psi
Ash	74.2 %	74.2 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80	Cull hot, 75 sec @ 165°C
Flexural Strength	110.3 MPa	16000 psi
Flexural Modulus	11.72 GPa	1700 ksi

Electrical Properties	Metric	English	Comments
Volume Resistivity	9.50e+15 ohm-cm	9.50e+15 ohm-cm
Dielectric Constant	3.3 @Frequency 1000 Hz	3.3 @Frequency 1000 Hz
Dielectric Strength	>= 15.7 kV/mm	>= 400 kV/in
Dissipation Factor	0.00030 @Frequency 1000 Hz	0.00030 @Frequency 1000 Hz
Arc Resistance	>= 180 sec	>= 180 sec	110V AC

Thermal Properties	Metric	English	Comments
CTE, linear	15.9 µm/m-°C @Temperature 20.0 °C	8.83 µin/in-°F @Temperature 68.0 °F	Alpha 1, 2 hr post cure
	16.5 µm/m-°C @Temperature 20.0 °C	9.17 µin/in-°F @Temperature 68.0 °F	Alpha 1, 15 min post cure
	16.7 µm/m-°C @Temperature 20.0 °C	9.28 µin/in-°F @Temperature 68.0 °F	Alpha 1, as molded
	61.0 µm/m-°C @Temperature 20.0 °C	33.9 µin/in-°F @Temperature 68.0 °F	Alpha 2, as molded
	65.0 µm/m-°C @Temperature 20.0 °C	36.1 µin/in-°F @Temperature 68.0 °F	Alpha 2, 15 min post cure
	66.0 µm/m-°C @Temperature 20.0 °C	36.7 µin/in-°F @Temperature 68.0 °F	Alpha 2, 2 hr post cure
Thermal Conductivity	0.657 W/m-K	4.56 BTU-in/hr-ft²-°F	2 hr post cure, 175°C
Glass Transition Temp, Tg	150 °C	302 °F
	160 °C	320 °F	15 min post cure
	162 °C	324 °F	2 hr post cure
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in
Oxygen Index	30 %	30 %

Processing Properties	Metric	English	Comments
Mold Temperature	165 - 175 °C	329 - 347 °F
Back Pressure	3.45 - 6.89 MPa	500 - 1000 psi
Cycle Time - Injection	30 - 40 sec	30 - 40 sec	at 165-175°C
Cure Time	0.000 - 15.0 min @Temperature 165 - 170 °C	0.000 - 0.250 hour @Temperature 329 - 338 °F	Post mold
Gel Time	0.233 min	0.233 min	Ram follower, at 165°C
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Cl	<1 ppm

**
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PPLASK020 / 56310

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