This material is a low stress molding compound specifically formulated for use with automated molding equipment to increase semiconductor manufacturing productivity and reduce production costs. This compound is recommended for molding of stress sensitive DIPs, SOICs, PLCCs and small QFPs. Features: - Consistent, expedient moldability
- Broad range of molding temperatures
- Fast cycle times
- Low viscosity
- Minimal post mold cure
- Low stress
Information provided by Cookson Electronics |