Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end assemblies, watertight electrical connectors, cables, printed circuitry, and other electrical components. It provides a quick gel to prevent too much flow. Features: - Outstanding environmental performance
- Controlled flow
- Easy Mixing
- Available in Triggerbond® Cartridges
Information provided by Epoxies, Etc |