| Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30P produces high strength, rigid bonds which are resistant to chemicals including water, oil, acids, and many organic solvents. It is serviceable over the wide temperature range of -60°F to + 250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, and many plastics, especially polycarbonates and acrylics. EP30P has low linear shrinkage upon cure as well as good optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting compound. EP30P is widely used in fiber optics, electro-optics, optical, and related industries. EP30P can be conveniently dispensed with a gun type mixing device. Product Advantages: - Convenient mixing: 4 to one 1 by weight, low viscosity.
- Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly.
- Versatile cure schedules: ambient temperature cures or fast, elevated temperature cures as required.
- Forms high strength, rigid bonds to a wide variety of substrates, particularly glass, polycarbonates and acrylics.
- Good optical clarity.
- Exceptionally low shrinkage.
- Excellent electrical insulation properties.
- Low viscosity, ideal for potting and encapsulation.
- Outstanding chemical resistance to water, acids, bases and salts.
Information provided by MasterBond® |
