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Ensinger PEI
Master Bond EP39MHT Two Component, Room Temperature Curing Epoxy Resin System
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy Encapsulant, Unreinforced

Material Notes: Key Features:
  • For potting and encapsulation
  • Serviceable up to 400°F
  • Superior chemical resistance
  • Excellent electrical insulation properties
  • Minimal shrinkage and stress development
  • Resists thermal cycling and mechanical shocks
Product Description: Master Bond EP39MHT is a low viscosity, two component, epoxy system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to an exceptionally tough and thermally stable thermosetting polymer featuring outstanding electrical insulation properties and remarkably high resistance to thermal shocks and mechanical vibration. EP39MHT also features inertness upon exposure to water and a wide range of chemicals plus capability for sustained service at temperatures up to as high as 400°F. As it develops very little heat during curing, it is particularly desirable for casting thick sections with complicated geometrical configurations up to several inches as well as thin sections with minimal shrinkage and stress development. EP39MHT is especially recommended for use in applications where cured assemblies must retain excellent electrical insulation and mechanical strength properties. This is true even upon exposure to adverse environmental conditions at both ambient and elevated temperatures in the presence of water, many organic solvents and other chemicals. The cured epoxy exhibits high resistance to thermal cycling and many chemicals including water, acids, bases and solvents such as ethyl alcohol, toluene, etc. Adhesion to both similar and dissimilar substrates such as metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. The color for Part “A” is clear and Part “B” is amber. EP39MHT is widely used in the electronics, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It has proven particularly successful for potting and encapsulation electronic assemblies with complicated geometrical configuration which are subject to thermal cycling and/or mechanical vibrations in adverse environments.

Product Advantages:

  • Convenient, non critical, easy to use, one to one mix ratio, by weight or volume
  • Low viscosity material flows evenly and spreads; ideal for potting and encapsulating
  • Versatile cure schedules; ambient temperature or fast elevated temperature cure
  • Excellent adhesion to a variety substrates

Information provided by Master Bond Inc.

Vendors:
Available Properties
  • Viscosity, mixed
  • Hardness, Shore D
  • Tensile Strength
  • Flexural Strength
  • Compressive Strength
  • Volume Resistivity
  • Dielectric Constant
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time
  • Working Life, After mixing, 100 g batch
  • Shelf Life, in original, unopened containers
  
Property Data

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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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