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Master Bond adhesives
Park Aerospace Nelco® N4000-7 EF® Halogen-Free Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: The Nelco® N4000-7 EF® series of laminates and prepregs is a total environmental solution. This advanced halogen-free resin system provides superior CAF resistance for high temperature, lead-free assembly designs.

Key Features and Benefits:

  • Outstanding moisture resistance and thermal stability
  • Uncompromised electrical values
  • Halogen-Free
  • CAF resistant
  • High Tg FR-4 processing

Applications/Qualifications:

  • Lead-Free Assemblies
  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • Automotive Electronics
  • MCM-Ls
  • Direct Chip Attach
  • Wireless Communications
  • Telecommunications Infrastructure
  • RoHS Compliant
  • Meets IPC-4101/94 Specifications

Information provided by Park Electrochemical Corp.

Key Words: EP
Vendors:
Available Properties
  • Density, 50% Resin Content; Internal Method
  • Water Absorption, IPC-TM-650.2.6.2.1
  • Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
  • Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
  • Peel Strength, IPC-TM-650.2.4.8, after solder float
  • Volume Resistivity, IPC-TM-650.2.5.17.1, C - 96/35/90
  • Volume Resistivity, IPC-TM-650.2.5.17.1, E - 24/125
  • Surface Resistance, IPC-TM-650.2.5.17.1, C - 96/35/90
  • Surface Resistance, IPC-TM-650.2.5.17.1, E - 24/125
  • Dielectric Constant, Internal Method, Split Post Cavity
  • Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
  • Dielectric Constant, IPC-TM-650.2.5.5.3, TFC/LCR Meter
  • Dielectric Strength, IPC-TM-650.2.5.6.2
  • Dielectric Breakdown, IPC-TM-650.2.5.6
  • Dissipation Factor, IPC-TM-650.2.5.5.3, TFC/LCR Meter
  • Dissipation Factor, Internal Method, Split Post Cavity
  • Arc Resistance, IPC-TM-650.2.5.1
  • CTE, linear, IPC-TM-650.2.4.41, X/Y
  • CTE, linear, IPC-TM-650.2.4.41, Z-Axis Alpha 1
  • CTE, linear, IPC-TM-650.2.4.41, Z-Axis Alpha 2
  • Specific Heat Capacity, ASTM E1461-92
  • Thermal Conductivity, ASTM E1461-92
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.24.3, DMA
  • Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
  • Flammability, UL94
  
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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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