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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.

Advantages & Application Notes:•

  • This product is the two component version of EPO-TEK® E3001. The two component version can offer advantages such as: lower cost, room temperature shipment instead of pre-mixed and frozen dry ice shipments, and maximum pot-life observed at site.
  • Versatility & Cure: snap cures of 90 seconds, fast cures of 15 minutes and traditional oven cures of 1-3 hours can be realized.
  • Designed for JEDEC Level III and II packaging criteria.
  • Compatible with die sizes up to 250 mil x 250 mil. Also recommended for small die such as LEDs and GaAs devices like 10 mil x 10 mil.
  • Beneficial radius of curvature after die-attach cure.
  • Compatible with high volume, automated syringe dispensing manufacturing processes.
  • Suggested applications:
    • Semiconductor: die attach onto lead-frames such as Ag spot die paddle, COB, advanced packages, and hybrid circuits.
    • Hybrid Microelectronics: die attach bonding onto ceramic PCB, as well as attaching SMDs onto the same substrate.
    • Opto-electronics:
      • Die attach of LEDs, LED arrays, LED on PCB, or packaged onto lead-frames.
      • Die attach epoxy for near-IR chips used in IRDA (Infra Red Data Acquisition).
      • Die-attach bonding of laser diode or photo-diode for fiber optics packaging.
  • Many modifications are available, including lower temperature cure, lower stress, longer pot-life, and higher thixotropic index.

Information Provided by Epoxy Technology

Available Properties
  • Specific Gravity, Part B
  • Specific Gravity, Part A
  • Viscosity, 100 rpm
  • Ionic Impurities - Cl (Chloride)
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Volume Resistivity, 200°C/2 min
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
  • Decomposition Temperature, TGA, Degradation Temperature
  • Cure Time, Bond Line
  • Cure Time, Bond Line
  • Cure Time, Bond Line
  • Pot Life
  • Shelf Life
Property Data

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Chemically Resistant adhesives
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