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Ensinger PEI
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, High Temperature

Material Notes: Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications

Advantages & Application Notes:

  • EPO TEK® 353ND-BLACK has been color-coded black for optical applications requiring opacity against light in IR and VIS region.
  • Reasonable pot-life that allows for low temperature curing to be realized.
  • Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
  • Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high temperature packaging.
  • Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:
    • Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range
    • Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
    • Down-Hole petrochemical fiber optic sensors, resisting >200 C field conditions
  • Medical suggested applications:
    • Potting Fiber Optic bundles into SST ferrules for light guides and endoscopes, resisting sterilization cycles of autoclave, ETO, gamma, H202 plasma
  • Electronics Assembly suggested applications:
    • Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices
    • Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets
    • Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnets

Information Provided by Epoxy Technology

Vendors:
Available Properties
  • Specific Gravity, Part B
  • Specific Gravity, Part A
  • Viscosity, 50 rpm
  • Ionic Impurities - Na (Sodium)
  • Ionic Impurities - K (Potassium)
  • Ionic Impurities - Cl (Chloride)
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
  
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Manufacturer Notes:
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Category Notes
Plastic

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