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Chemically Resistant adhesives
Park Aerospace Nelco® N4000-7 SI® FR-4 Epoxy Laminate and Prepreg
Categories: Polymer; Thermoset; Epoxy

Material Notes: The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stability and superior hole-wall integrity.

Key Features and Benefits:

  • Outstanding Z-axis, thermal stability and hole wall integrity
  • Automotive Testing
  • SI (Signal Integrity) option
  • CAF resistant
  • Cost-effective standard FR-4 processing

Applications/Qualifications:

  • Wireless Handsets
  • Wireless Infrastructure
  • Digital Broadband Multilayers
  • Automotive
  • Underhood Automotive
  • Backplanes
  • Fine-Line Multilayers
  • Fine Pitch BGA Multilayers
  • Direct Chip Attach
  • RoHS Compliant
  • Meets IPC-4101/98 Specifications

Information provided by Park Electrochemical Corp.

Key Words: EP
Vendors:
Available Properties
  • Density, 50% Resin Content; Internal Method
  • Water Absorption, IPC-TM-650.2.6.2.1
  • Peel Strength, IPC-TM-650.2.4.8, after solder float
  • Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
  • Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
  • Volume Resistivity, IPC-TM-650.2.5.17.1, E - 24/125
  • Volume Resistivity, IPC-TM-650.2.5.17.1, C - 96/35/90
  • Surface Resistance, IPC-TM-650.2.5.17.1, E - 24/125
  • Surface Resistance, IPC-TM-650.2.5.17.1, C - 96/35/90
  • Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
  • Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
  • Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
  • Dielectric Constant, IPC-TM-650.2.5.5.3, TFC/LCR Meter
  • Dielectric Strength, IPC-TM-650.2.5.6.2
  • Dielectric Breakdown, IPC-TM-650.2.5.6
  • Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
  • Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
  • Dissipation Factor, IPC-TM-650.2.5.5.3, TFC/LCR Meter
  • Arc Resistance, IPC-TM-650.2.5.1
  • CTE, linear, IPC-TM-650.2.4.41, X/Y
  • CTE, linear, IPC-TM-650.2.4.41, Z-Axis Alpha 1
  • CTE, linear, IPC-TM-650.2.4.41, Z-Axis Alpha 2
  • Specific Heat Capacity, ASTM E1461
  • Thermal Conductivity, ASTM E1461
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.24.3, DMA (Tan d Peak)
  • Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
  • Flammability, UL94
  
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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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Chemically Resistant adhesives
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