| Description: Master Bond Polymer Adhesive EP51AN is a two component, thermally conductive, electrically insulating epoxy adhesive, sealant, and coating with a 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive, it forms high strength bonds of over 1200 psi tensile shear. EP51AN resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of 4°K to +250°F. The temperature range as indicated allows EP51AN to be used in many cryogenic applications requiring good heat transfer. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP51ANLV is also available. That system is particularly well suited for certain potting applications. It is suggested that Master Bond EP51AN be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line assemblies and high speed bonding operations. A faster setting version called EP51M-AN; working life 3-5 minutes, full cure 3-4 hours, also is available. Product Advantages: - Convenient mixing: non-critical equal weight or volume ratio.
- Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly; self leveling feature.
- Fast cures at room temperature.
- High bonding strength to a wide variety of substrates.
- Low coefficient of expansion, low shrinkage, good dimensional stability.
- Great durability, thermal shock and chemical resistance.
- Thermal conductivity, over 25 BTU•in/ft2 •hr•°F.
- Excellent electrical insulation properties.
- Faster curing version, EP51M-AN is available.
Information provided by MasterBond® |
