Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) FR-1047 / EA-117 Conapoxy® Resin / Conacure® Hardener Flame retardant (UL 94V-0), filled, non-abrasive casting system with excellent thermal shock resistance, low exotherm, very good arc resistance, and high heat distortion properties.
- Mix Ratio, Resin/Hardener (by weight): 100/7
Cure Type: Elevated Temperature Information provided by Cytec, subsequently acquired by Elantas. |