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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free” alternative in circuit assembly applications found in semiconductor, medical, consumer and hybrid/military industries.

Advantages & Application Notes:

  • The thixotropic and paste-like rheology allows for application by screen or stencil printing techniques. It was designed to be printed for SMT joining similar to printing solder paste. It may also be hand applied or dispensed.
  • A “lead-free” solution for PCB level circuit assemblies. It is suggested to use this epoxy with SMDs that do not contain Pb plated leads. Preferable to solder:
    • Lead-free can be an environmental advantage
    • Silver epoxy curing at 150°C is a lower temperature solution than 180-220°C SMT solder reflow.
    • Electrically conductive adhesives can be used on flip chips and ultra-fine pitch count SMDs, avoiding the problems of solder bridging.
  • NASA approved low outgassing epoxy
  • Can be used on mixed technology hybrid substrates or PCBs. Adhesive deposit, pick-and-place, and cure can be accomplished in single step fashion.
  • Suggested surface finishes, contact pads, or leads: Ag, Ag-Pd, Au, and Cu. Compatible with PCBs including FR4, BT, ceramic, and flex circuits.

    Information Provided by Epoxy Technology

Available Properties
  • Specific Gravity, Part B
  • Specific Gravity, Part A
  • Particle Size
  • Viscosity, 1 rpm
  • Ionic Impurities - Cl (Chloride)
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
  • Decomposition Temperature, TGA, Degradation Temperature
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
Property Data

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Chemically Resistant adhesives
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