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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK®E4110, suggested for applications requiring a screen printing process as well as jetting.

Advantages & Application Notes:

  • A thixotropic paste which enables ultra-fine pitch applications at the wafer or PCB/substrate packaging level. It may be dispensed, printed or jetted.
  • Semiconductor Flip Chip Suggested Applications:
    • Flip Chip attaching of IC’s direct to substrate or in semiconductor advanced plastic packages.
    • “Dots” of E4110-PFC may be realized at 75µm diameter and 125µm pitch.
    • Compatible with screen printing processes, whether mesh or stencil foils. The former requires > 200 mesh wires while the latter should be laser etched SST foil.
    • Capable of curing at temperatures as low as 45°C for solder replacement.
  • Medical Suggested Applications:
    • Electrically conductive bridge when bonding Au-plated piezo-ceramic arrays to PCBs, used in ultrasonic devices.
    • Flip chip attachment of photo-detector arrays found in X-ray and CT detectors
  • Opto-electronics Suggested Applications
  • Electrically conductive adhesive found in sensor and fiber optic devices
  • Electrical bridge of ITO contact pads to PCBs found in LCD/Displays and OLED’s
  • Flex Circuits suggested Applciations.
    • Solar / Photo-voltaic. Adhesive for electrically back-contacting, thin film, organic and dye sensitized solar cells.
    • Flip Chip adhesive dots bridging RFID chips to antennae, or smart card IC packaging.
    • Electrical bridge of Au/PZT arrays to Au/Kapton found on ink-jetting circuits

    Information Provided by Epoxy Technology

  • Vendors:
    Available Properties
    • Specific Gravity, Part B
    • Specific Gravity, Part A
    • Particle Size
    • Viscosity, 5 rpm
    • Ionic Impurities - Na (Sodium)
    • Ionic Impurities - K (Potassium)
    • Ionic Impurities - Cl (Chloride)
    • Hardness, Shore D
    • Tensile Modulus, Storage
    • Shear Strength, Lap
    • Shear Strength, Die
    • Volume Resistivity
    • CTE, linear, Below Tg
    • CTE, linear, Above Tg
    • Thermal Conductivity
    • Maximum Service Temperature, Air, Continuous
    • Maximum Service Temperature, Air, Intermittent
    • Minimum Service Temperature, Air, Continuous
    • Minimum Service Temperature, Air, Intermittent
    • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
    • Decomposition Temperature, TGA, Degradation Temperature
    • Cure Time, Minimum Bond Line
    • Cure Time, Minimum Bond Line
    • Cure Time, Minimum Bond Line
    • Pot Life
    • Shelf Life
    Property Data

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    Chemically Resistant adhesives
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