Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) FR-1080 Conapoxy® Resin / Conacure® Hardener An unfilled low viscosity system with high temperature operating capabilities.
- Mix Ratio, Resin/Hardener (by weight): 100/83
Cure Type: Elevated Temperature Information provided by Cytec, subsequently acquired by Elantas. |