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Rulon Bearings
Brewer Science BrewerBOND® 220 Temporary Wafer Bonding Material
Categories: Other Engineering Material

Material Notes: BrewerBOND® 220 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment. This product improves throughput, simplifies cleaning, and shortens processing time.

For coatings thicker than 20 µm, BrewerBOND® 220 material is a good option as an alternative solution to typical wax adhesives. It offers significant advantages because it can be applied with a one-coat process. The material provides up to a 160-µm film with a single coat and customized spin process. BrewerBOND® 220 material enables backside temperature processing up to 250°C with minimal device wafer bowing. BrewerBOND® 220 material does not introduce additional stress in the bonded stack. This versatile material can be used for the thermal slide or mechanical debonding methods.


  • Enables backside temperature processing at 200°C – 240°C
  • Enables slide debonding with low force
  • Enables minimal device wafer bowing during processes
  • Up to 160-µm film possible with a single coat and customized spin process BrewerBOND® 220 Bonding Material Coating Parameters (8” substrate) Static dispense in center of wafer.

Information provided by Brewer Science.

Available Properties
  • Viscosity, Complex Melt Viscosity
  • Viscosity, Complex Melt Viscosity
  • Viscosity, Complex Melt Viscosity
  • Viscosity, Complex Melt Viscosity
  • Brookfield Viscosity
  • Brookfield Viscosity
  • Thickness, Spin Speed 600 rpm
  • Thickness, Spin Speed 300 rpm
  • Transformation Temperature, Tg, DSC
  • Decomposition Temperature, 2% wt loss in TGA
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Master Bond adhesives
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