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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.

Advantages & Application Notes:

  • It is a snap cure version of EPO-TEK® H20E, designed for snap cure at 140°C and <15 minute cure at 120°C.
  • Strengths include dispensable rheology and a long pot life.
  • Suggested Applications:
    • Semiconductor: die-attaching IC’s onto Cu plated lead-frame yielding semiconductor plastic package formats.
    • PCB: solder replacement adhesive, electrical bridge of Au, Ag and AgPd electrode pads onto Au- or Cu-plated PCBs.
    • Photovoltaics:
      • Electrically conductive stringing of thin film, organic and crystalline Si solar cells.
      • Compatible with SnCu and AgCu metalized solar ribbons, and TCO substrates such as ITO, ZnO and SnO.
      • Versatility in ribbon bonding geometries, such as dotted or continuous line.
      • In-line/in-situ curing processes in <1 minute at 140°C can be achieved.
      • Reliable green strength holds solar ribbons in position prior to cure.
      • Low temperature cure is well suited for CIGS and OPV/DSC solar cells requiring a low temperature process.
      • Suitable for use on IEC 61646, IEC 61730 and UL 1703 certified solar panels.

Information Provided by Epoxy Technology

Available Properties
  • Specific Gravity, Part B
  • Specific Gravity, Part A
  • Particle Size
  • Viscosity, 50 rpm
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
Property Data

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Chemically Resistant adhesives
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