Park Aerospace Nelco® N7000-2 HT/N7000-3 Toughened Polyimide Laminate and Prepreg

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Park Aerospace Nelco® N7000-2 HT/N7000-3 Toughened Polyimide Laminate and Prepreg
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	The Nelco N7000-2 HT laminate and N7000-3 prepreg are a series of toughened polyimide materials for use in high-reliability multilayers. This combined resin system provides excellent thermal performance, improved processing characteristics and is exceptional for use in a wide variety of applications that include fine geometry multilayer constructions and extreme reliability requirements. Key Features and Benefits: Polyimide resin chemistry Lead-free assembly compatibility Supports current and previous military and industrial standards Reliable plated-through holes Reliable processing Applications/Qualifications: Fine-Line Multilayers Backplanes Surface-Mount Multilayers BGA Multilayers Direct Chip Attach Underhood Automotive Burn-in Boards Information provided by Park Electrochemical Corp.
Key Words:	PI
Vendors:

Available Properties

Density, 50% Resin Content; Internal Method
Water Absorption, IPC-TM-650.2.6.2.1
Modulus of Elasticity, ASTM D3039, X
Modulus of Elasticity, ASTM D3039, Y
Poissons Ratio, ASTM D3039, X
Poissons Ratio, ASTM D3039, Y
Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
Peel Strength, IPC-TM-650.2.4.8, after solder float
Volume Resistivity, IPC-TM-650.2.5.17.1, C - 96/35/90
Volume Resistivity, IPC-TM-650.2.5.17.1, E - 24/125
Surface Resistance, IPC-TM-650.2.5.17.1, C - 96/35/90
Surface Resistance, IPC-TM-650.2.5.17.1, E - 24/125
Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
Dielectric Constant, Split Post Cavity
Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
Dielectric Strength, IPC-TM-650.2.5.6.2
Dielectric Breakdown, IPC-TM-650.2.5.6
Dissipation Factor, Split Post Cavity
Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
Arc Resistance, IPC-TM-650.2.5.1
CTE, linear, IPC-TM-650.2.4.41
Specific Heat Capacity, ASTM E1461
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
Flammability, UL94

Property Data

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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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