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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe.

Advantages & Application Notes:

  • The thixotropic and paste-like rheology allows for application by screen or stencil printing techniques. It was designed to be printed for SMT joining similar to printing solder paste. It may also be hand applied or dispensed.
  • A “lead-free” solution for PCB level circuit assemblies. It is suggested to use this epoxy with SMDs that do not contain Pb plated leads. Preferable to solder:
    • Snap cure adhesive or fast-cure; chips can be cured in-line < 90 seconds travel time; or lead-frames can be loaded into magazines for box oven curing <15 minutes travel time at 180°C or higher; a traditional box-oven cure for several hours may also be used.
    • Excellent adhesion to die-paddle on lead-frames including Cu, Alloy 42, or Ag spot ring.
    • Bright and shiny silver epoxy after cure; suggested for LED die-attach packaging.
    • Compatible with COB die-attach process on Au plated PCB, Au plated ceramic PCB in hybrid packages or opto-electronic packaging using hybrids.
    • 24 hour pot-life for automated syringe dispensing; compatible with many dispensing methods: air pressure, positive displacement, and auger screws.
    • Soft and creamy thixotropic behavior. Rheology allows for high speed dispensing of dots, dot arrays, shower head dispensing, or the writing-pen method.
    • Suggested for JEDEC Level II packaging of semiconductor devices.

    Information Provided by Epoxy Technology

Available Properties
  • Specific Gravity
  • Particle Size
  • Viscosity, 100 rpm
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
  • Decomposition Temperature, TGA, Degradation Temperature
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
Property Data

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Chemically Resistant adhesives
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