Product Highlights:- Superior tensile lap shear strength
- Non drip property
- service up to 260°C
- Outstanding chemical resistance
- Superb electrical insulator
- Very high Tg (~ 158°C)
Kohesi Bond KB 1823 HTND is a true single component system that requires no mixing and cures hard at elevated temperatures. It readily cures at 150°C - 180°C for a period of 60 - 90 minutes. For optimum performance, a post cure for 2 hours at 180°C - 200° is highly recommended. This product has a slightly exothermic cure and it is recommended to cure it in bond line thickness of 2-8 mils. KB 1823 HTND offers an extensive service temperature range of -50°C to +260°C. It is primarily used a structural adhesive owing to its first-rate dimensional stability, tensile lap shear strength and compressive strength. KB 1823 HTND offers a non-drip paste consistency that will not flow even during cure. Being a one component system, it provides ease of application and also adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. KB 1823 HTND is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, KB 1823 HTND also offers excellent chemical resistance to a variety of acids, bases, fuels, oils and water. It has a gray color. With a combination of Excellent structural bonding, ease of use and handling, KB 1823 HTND is universally used in electronics, aerospace, specialty OEM and various other industries. Typical Applications: Information provided by Kohesi Bond Custom Engineered Adhesives |
