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Chemically Resistant adhesives
Parker Chomerics THERM-A-GAP™ GEL 8010 High Performance Fully Cured Dispensable Gel
Categories: Fluid

Material Notes: Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility. Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders; Lower temperature increases product life, typically a doubling of life based on every 10°C decrease in temperature; Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.

Typical Applications: Automotive Electronic Control Units (ECU’s), Power Supplies & Semiconductors, Memory & Power Modules, Microprocessors/Graphics Processors, and Flat Panel Displays & Consumer Electronics.

Features/Benefits: Easily dispensable, Fully-cured/No pump out, High bulk thermal conductivity, Low thermal impedance, Ultra low compression force, High tack surface & reworkable and Proven long-term reliability.

Product Attributes: Thin bondline gel (approximately 2-10 mils), Low thermal impedance gel, Stencil printable with no pump out, Ideal for high-volume dispensing, and Proven long-term reliability.

Information provided by Chomerics

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Thickness, Bondline thickness
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min
  • Outgassing - Total Mass Loss, ASTM E595, TML
  • Collected Volatile Condensable Material, ASTM E595
  • Volume Resistivity, ASTM D257
  • Dielectric Constant, ASTM D150
  • Dielectric Strength, ASTM D149
  • Dissipation Factor, Chomerics
  • CTE, linear, ASTM E831
  • Specific Heat Capacity, ASTM E1269
  • Thermal Conductivity, ASTM D5470
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Flammability, UL94
  • Shelf Life, From date of Manufacture
  
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Chemically Resistant adhesives
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