| Product Description: Master Bond Polymer System EP21DP11 is a low viscosity, two component, flexible epoxy compound for high performance bonding, sealing, casting, coating, and potting applications. It is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient 2:1 mix ratio. This compound is 100% reactive and does not contain any solvents or diluents. Also, one special feature it contains is an air release agent, which is particularly useful for potting and encapsulating. Master Bond EP21DP11 is particularly recommended in potting and casting applications where a low viscosity is required and there is extensive thermal cycling up to 250°F. The material is a superb electrical insulator, resistant to many chemicals and adheres well to a wide variety of substrates. It has a service temperature range of -60°F to +250F. Part A is red and part B is amber clear. Product Advantages: - Convenient 2:1 mix ratio, by weight.
- Low viscosity makes it well suited for casting and potting.
- Good flexibility; capable of withstanding thermal cycling.
- Cures at ambient temperatures or faster elevated temperatures.
- Air release agent facilitates degassing.
- Easily visible red color.
Information provided by Master Bond Inc. |
