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Metal adhesives
Master Bond EP21NDCL Two Part Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Key Features:
  • Room temperature curing system
  • User friendly processing
  • Non-flowing paste
  • Cures optically clear in thin sections
  • Exceptional physical and electrical properties
  • Adjustable mix ratio
Product Description: Master Bond EP21NDCL is a two component, room temperature curing epoxy system that has a non-drip consistency. What is really eye-catching about this product is that even though Part A is translucent and Part B is light amber, upon mixing it cures optically clear, especially in thin sections. EP21NDCL combines easy processing, outstanding physical strength properties along with excellent electrical insulation values. The processing is straightforward and relatively easy; the mix ratio is a non-critical 1 to 1 by weight or volume. In fact, it can be mixed 2 to 1 so that it cures more rigid or 1 to 2 to effect a more flexible cure. EP21NDCL produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. It bonds well to a variety of substrates including metals, composites, glass, ceramics and many types of rubbers and plastics (most notably acrylics and polycarbonates). It is serviceable over the wide temperature range of -60°F to +250°F. This exceptionally versatile system can be effectively utilized in optical, opto-electronic, electrical, aerospace and specialty OEM industries where an optically clear, non-drip epoxy is desirable.

Product Advantages:

  • Easy to work with and use
  • Long open time; paste consistency
  • High bond strength to many different substrates
  • Superior physical strength profile
  • High quality optical clarity especially in thin sections

Information provided by Master Bond Inc.

Vendors:
Available Properties
  • Hardness, Shore D
  • Tensile Strength
  • Elongation at Break
  • Tensile Modulus
  • Compressive Strength
  • Adhesive Bond Strength, Tensile lap, Aluminum to Aluminum
  • Volume Resistivity
  • Dielectric Constant
  • CTE, linear
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time, plus 2 hrs at 150-200°F, Optimal cure
  • Cure Time
  • Working Life, After mixing, 100 g batch
  • Shelf Life, in original, unopened containers
  
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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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Metal adhesives
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