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Metal adhesives
Master Bond EP17HT-100 One Component Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, High Temperature; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • Requires no mixing
  • Not premixed and frozen
  • Superb high temperature resistance
  • Highly dimensionally stable
  • Conducts heat while still being electrically isolating
  • Can be cast in thicknesses up to 1/2 inch
Product Description: Master Bond EP17HT-100 is a high performance, one part epoxy that combines easy handling with superb physical properties. The use of this epoxy is straightforward and simple. EP17HT-100 is not premixed and frozen and has unlimited working life at room temperature. It has a moderate viscosity with good flow properties, and can be used for potting and encapsulation in thicknesses up to ½ inch. Most importantly, EP17HT-100 cures in 60-90 minutes at 200-220°F, or 45-60 minutes at 275-300°F. Optimal properties are achieved with curing at 3-4 hours at 300°F followed by post curing at 350-400°F for a few hours, if possible. And, although the best properties are obtained by going with the higher temperature curing, the 200-220°F schedule still gives very good physical strength values along with first rate thermal conduction and electrical insulation numbers as well. It bonds well to metals, composites, ceramics, glass and many plastics. EP17HT-100 has superior chemical resistance to oils, fuels, acids, bases, water and many solvents. The service temperature range is -100°F to +500°F. EP17HT-100 is naturally yellow-tan, but other colors are available. Storing at 40-50°F is more than sufficient and freezing is not required nor recommended. EP17HT-100 is an excellent choice in aerospace, electronic, optical and other high-tech applications, where the blend of a non-mix system, a lower heat curing schedule and robust properties, especially temperature resistance, is desirable.

Product Advantages:

  • Single component; no mixing needed
  • Unlimited pot life at room temperature
  • Versatile cure schedules starting at 200-220°F
  • Readily flowable
  • Notable mechanical strength properties
  • Especially useful in applications involving more temperature sensitive substrates

Information provided by Master Bond Inc.

Vendors:
Available Properties
  • Viscosity, thixotropic
  • Tensile Strength, Tensile lap, Aluminum to Aluminum, 90 min cure at 200°F
  • Tensile Strength, Tensile lap, Aluminum to Aluminum, 60 min cure at 250°F
  • Tensile Strength, Tensile lap, Aluminum to Aluminum, Optimum cure: 4 min cure at 300°F plus post cure
  • Adhesive Bond Strength, Tensile lap, Aluminum to Aluminum, 90 min cure at 200°F
  • Adhesive Bond Strength, Tensile lap, Aluminum to Aluminum, 60 min cure at 250°F
  • Adhesive Bond Strength, Tensile lap, Aluminum to Aluminum, Optimum cure: 4 min cure at 300°F plus post cure
  • Volume Resistivity, 90 min cure at 200°F
  • Volume Resistivity, 60 min cure at 250°F
  • Dielectric Constant, Optimum cure: 4 min cure at 300°F plus post cure
  • Dielectric Constant, 60 min cure at 250°F
  • Dielectric Constant, 90 min cure at 200°F
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time
  • Cure Time, Optimum cure, plus post cure for a few hours at 350-400°F
  • Shelf Life, in original, unopened containers
  
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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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Metal adhesives
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