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Master Bond adhesives
Park Aerospace Nelco® N5000 BT Epoxy Laminate and Prepreg
Categories: Polymer; Thermoset; Epoxy

Material Notes: The Nelco N5000 BT epoxy laminate and prepreg system provides superior electrical properties. The N5000 resin system wasoriginally developed for application specific use in high densitymilitary and commercial boards requiring not only close thicknesstolerance, but also the ability to withstand the stress of multiple soldering excursions and repeated chemical exposure.

Key Features and Benefits:

  • BT resin chemistry
  • Excellent Reliability and Performance
  • CAF Resistant
  • Wide processing latitude

Applications/Qualifications:

  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • MCM-Ls
  • Direct Chip Attach
  • Wireless Communications
  • High Density Interconnects
  • RoHS Compliant
  • Meets IPC-4101/30 Specifications

Information provided by Park Electrochemical Corp.

Key Words: EP
Vendors:
Available Properties
  • Density, 50% Resin Content; Internal Method
  • Water Absorption, IPC-TM-650.2.6.2.1
  • Modulus of Elasticity, ASTM D3039, Y
  • Modulus of Elasticity, ASTM D3039, X
  • Poissons Ratio, ASTM D3039, Y
  • Poissons Ratio, ASTM D3039, X
  • Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
  • Peel Strength, IPC-TM-650.2.4.8, after solder float
  • Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
  • Volume Resistivity, IPC-TM-650.2.5.17.1, C - 96/35/90
  • Volume Resistivity, IPC-TM-650.2.5.17.1, E - 24/125
  • Surface Resistance, IPC-TM-650.2.5.17.1, C - 96/35/90
  • Surface Resistance, IPC-TM-650.2.5.17.1, E - 24/125
  • Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
  • Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
  • Dielectric Constant, Split Post Cavity
  • Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
  • Dielectric Strength, IPC-TM-650.2.5.6.2
  • Dielectric Breakdown, IPC-TM-650.2.5.6
  • Dissipation Factor, IPC-TM-650.2.5.5.5, Split Post Cavity
  • Dissipation Factor, Stripline
  • Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
  • Arc Resistance, IPC-TM-650.2.5.1
  • CTE, linear, IPC-TM-650.2.4.41, X/Y
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.24.3, DMA (Tan d Peak)
  • Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
  • Flammability, UL94
  
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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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