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Rulon Bearings
Brewer Science BrewerBOND® 510 Temporary Bonding Material
Categories: Other Engineering Material

Material Notes: Temporary wafer bonding release material for mechanical debonding applications.

BrewerBOND® 510 material is applied to a carrier using a simple process and is compatible with =300°C bonding materials. After processing, a low-force separation method is used to debond, and the carrier could potentially be reused. Because the carrier may be reused (depending on metallization processes), this material has a lower cost of ownership than other options, making it ideal for entry into the wafer-bonding space or for projects with smaller throughput requirements.

Key Market Sectors include 3-D wafer-level packaging, MEMS, and Compound semiconductor.

Benefits include Compatible with 250°C - 300°C bonding materials; Simple application on carrier; Lower cost of ownership with carrier reuse; Carrier rework by RCA clean or ash; and Low-force separation.

Information provided by Brewer Science.

Available Properties
  • Thickness, Spin Speed 1700 rpm
  • Thickness, Spin Speed 1100 rpm
  • Thickness, Spin Speed 800 rpm
  • Decomposition Temperature, 2% wt loss in TGA
  • Refractive Index
  • Processing Temperature, Proximity Bake
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Master Bond adhesives
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