Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) FR-1050 Conapoxy® Resin / Conacure® Hardener A low cost filled epoxy potting system. It has convenient 2 to 1 mix ratio and low viscosity.
- Mix Ratio, Resin/Hardener (by weight): 100/50
Cure Type: Room Temperature Information provided by Cytec, subsequently acquired by Elantas. |