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Ensinger PEI
Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, High Temperature

Material Notes: Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications.

Advantages & Application Notes:

  • Paste-like viscosity allows for application by dispensing, or hand methods such as toothpick, spatula or pin transfer.
  • Color change upon cure – off-white to amber-brown - allows easy visual inspection.
  • The CTE value below the Tg keeps potential stress to a minimum.
  • Suggested applications:
    • Fiber Optic Packaging
      • Sealing fiber into the snout, ferrule, or feed-through of the opto-package.
      • Mounting optics, such as lenses, diodes, prisms, onto the substrate or “optical bench.”
      • Adhesive for building the optical bench to the correct Z-height.
      • “Toughened” adhesive to prevent fiber from the “piston effect”.
    • Semiconductor
      • As underfill of flip chip devices and SMDs like BGAs, capacitors and resistors.
    • Medical
      • As an alternative to EPO-TEK® 353ND for moisture resistance.
  • Capable of short cure cycles at low temperature, such as 80°C.

Information Provided by Epoxy Technology

Available Properties
  • Specific Gravity, Part B
  • Specific Gravity, Part A
  • Particle Size
  • Viscosity, 10 rpm
  • Ionic Impurities - Na (Sodium)
  • Ionic Impurities - Cl (Chloride)
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Cure Time, minimum
  • Cure Time, minimum
  • Cure Time, minimum
  • Cure Time, minimum
  • Pot Life
  • Shelf Life
Property Data

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