Henkel Loctite® ABLESTIK 8008MD Adhesive

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Henkel Loctite® ABLESTIK 8008MD Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Product Benefits: Electrically conductive Thermally conductive Low modulus Good substrate wetting Controlled bondline thickness Cure: Heat cure Application: Die attach Filler Type: Silver Substrates: PPF, Copper and Silver-plated copper leadframes LOCTITE ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	67500 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	440 MPa @Temperature 250 °C	Cured, DMTA
	630 MPa @Temperature 200 °C	Cured, DMTA
	1050 MPa @Temperature 150 °C	Cured, DMTA
	3880 MPa @Temperature 25.0 °C	Cured, DMTA
	7702 MPa @Temperature -65.0 °C	Cured, DMTA

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00050 ohm-cm

Thermal Properties	Original Value	Comments
Thermal Conductivity	6.00 W/m-K	Cured

Processing Properties	Original Value	Comments
Cure Time	10.0 min	ramp to 115°C + 60 minutes @ 115°C, Recommended B-Stage Condition
	30.0 min	ramp to 175°C + 60 minutes @ 175°C, Recommended Cure Schedule
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
Shear Strength	2.5 kg-f	Die, 3 x 3 mm Si die on Bare Cu Leadframe @ 260°C
	2.7 kg-f	Die, 3 x 3 mm Si die on Ag/Cu Leadframe @ 260°C
	3 kg-f	Die, 3 x 3 mm Si die on Pd/Ni/Cu Leadframe @ 260°C
Thixotropic Index	2.6	Uncured, 0.5/5 rpm
Weight Loss (%)	0.2	Cured, 250°C

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PLOCT5025 / 255236

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