Henkel Loctite® CHIPBONDER® 3619 Low Temperature Cure, Syringe Dispense

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Henkel Loctite® CHIPBONDER® 3619 Low Temperature Cure, Syringe Dispense
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	Surface Mount Adhesives Loctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer. Loctite® syringe dispense products provide good performance for electronics assembly: High Speed Dispense Low Temperature Cure Products for difficult-to-bond substrates Loctite® 3619 CHIPBONDER® Low Temperature Cure, Syringe Dispense A low temperature curing adhesive designed for high-speed syringe dispense. Peaked dot profile. Process Method: High speed Syringe dispensing 40,000 DPH capable Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)
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Processing Properties	Metric	English	Comments

Cure Time	1.50 min @Temperature 100 °C	0.0250 hour @Temperature 212 °F
Shelf Life	6.00 Month	6.00 Month	From date of manufacture

Descriptive Properties
Color	Red

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PLOCT210 / 51946

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